With the increasing demand for component output in LED lighting applications, traditional LED packages not only limit component specification, but also disadvantageous heat dissipation. Novel unpackaged LEDs have better heat dissipation conditions, while integrating epitaxial, die and package processes. Conveniently paired with secondary optics to design lighting fixtures…
LED light source applications will gradually shift to LED general lighting applications after the peak demand for LCD backlight applications. However, unlike the LCD backlight module design, the LCD backlight module does not need to consider the optical and lighting application conditions, and the luminous efficiency requirements of the unit module are the main requirements; however, in addition to the brightness requirements, the LED lighting application must additionally consider the optical type, heat dissipation, Whether it is conducive to the secondary optical design, and the requirements of the design and configuration of the luminaire, the requirements for the LED light source components are actually higher.
Early packaging technology limits many thermal issues affecting high-brightness design development
Early LED light source components, packaging materials mainly used in the shell-type package, in the early days of high-efficiency blue LEDs are quite common, and in the promotion of the thin design requirements of smart phones and mobile phone products, the use of surface-mount devices (surface-mount devices; The demand for LED light sources of SMD type is increasing, and the LED light source components designed by surface adhesion technology can accelerate the production processing efficiency by using the tape-type tape loading material, and increase the processing efficiency through automated production, and also bring LEDs. The new application market of packaging technology, coupled with the subsequent advancement of epitaxial structure and packaging technology, and the mutual improvement of LED light source materials can gradually surpass the performance of traditional lamps.
In view of lighting application requirements, lighting fixtures have higher and higher requirements for luminous performance, and LED light sources are currently the key to the optical output performance. The luminous efficiency is mainly represented by epitaxial, die and packaging technology solutions. At present, the unit luminous efficiency of epitaxial has been approaching the limit, and the space for luminous efficiency to jump and grow is relatively limited.
Continuously increasing the grain area and improving the packaging technology is a feasible solution that can greatly increase the luminous efficiency of a unit component. However, if the cost performance of components can be improved, the increase in die area will be less cost-optimized, but the choice of packaging technology will directly affect the cost of the terminal material components. That is to say, packaging technology will become the cost of LED lighting. .
Chip-scale package-introduced LEDs are small in size and highly reliable
Chip Scale Package (CSP) is the most popular packaging technology solution in the LED industry in 2013. In fact, CSP is not a new technology in the semiconductor industry, but it is still a novel advanced technology in the application of LED light source components. In traditional semiconductor chip-scale packaging applications, the purpose is to reduce the final volume of the packaged components, while improving heat dissipation and improving the application reliability and stability of the chip itself. The chip-level package of the LED light-emitting component is mainly defined as that the package is close to the LED chip or the package volume is not more than 20% of the chip, and the chip-packaged LED itself must be a fully functional package component.
Chip-level package is mainly to improve the continuous increase of logic chip pins, component heat dissipation performance and chip miniaturization. Through chip-level package integration benefits, chip component parasitic phenomena can be reduced, and component integration of Level 2 package can be increased. And the chip-level package in the application requirements of LED light source devices can also achieve a significant degree of benefit.
A typical chip-scale package does not require an additional secondary substrate, lead frame, etc., but can be directly attached to the carrier board. The chip-scale package is made of the P/N electrode of the LED diode at the bottom of the chip. By using the surface adhesion automation method for component assembly, if it is necessary to wire the component manufacturing process, the chip-level package can relatively improve the assembly and test process, and at the same time achieve the dual purpose of reducing processing complexity and cost.
LED adopts chip-level packaging scheme, components can obtain better heat dissipation performance, high lumen output, high package density, more flexibility, and simplified substrate. At the same time, the wire bonding process can be reduced and the reliability of terminal components can be improved.